MicroPower Technologies Appoints New Vice President of Engineering

MicroPower Technologies Inc., an award-winning provider of surveillance solutions optimized for rapid, cost-effective deployment, announced today the appointment of Tim McConnell as Vice President of Engineering. In this new role, McConnell will spearhead technology strategy and development, and lead the engineering team as it further develops rich feature-sets and increased functionality for the company's advanced technology portfolio.

McConnell brings more than 25 years of product development, engineering, executive-level leadership and corporate strategy experience to MicroPower. Additionally, McConnell has extensive experience in the areas of digital video, smart grid and mobile wireless development, all of which correlates strongly with MicroPower's core technology strategy.

Prior to joining MicroPower, McConnell served as Vice President of Engineering for 3D Robotics, where he helped develop unmanned aerial vehicles for consumer and commercial use. Previously, he held the role of Executive Vice President of Engineering at Solekai Systems. McConnell holds a Master's of Science and Bachelor's of Science in mechanical engineering from the Massachusetts Institute of Technology (MIT).

"As MicroPower builds upon its leadership in wireless and solar-powered surveillance solutions, we look to add key members to our leadership team that will help drive continued success," said Aaron Tankersley, CEO, MicroPower Technologies. "Tim's expertise will help create new capabilities on our next generation surveillance platform, which allows users to increase security and safety, and optimize operations in a wide variety of applications."